For structural-bonding applications requiring high thermal performance with absorption of mechanical stresses, new Bond-Ply® LMS-HD from Bergquist Company delivers an effective and easy-to-use solution. Bond-Ply LMS-HD consists of a thermally conductive low-modulus silicone compound coated on a cured core, and double lined with protective films. This design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch, or by shock and vibration. Two thickness grades give designers a choice of 0.254mm or 0.305mm thicknesses for structurally adhering discrete semiconductors such as power components, or PCBs, to a heat sink.
A choice of assembly techniques is allowed, permitting assemblers to achieve high thermal conductivity after lamination at constant pressure of 75 psi or by using Initial Pressure Only (IPO) lamination. A test assembly using a TO-220 power package has demonstrated thermal impedance of 2.3 degrees C/W after IPO lamination. Bond-Ply LMS-HD ensures very low interfacial thermal resistance, which helps maximize heat transfer.
Comments are closed.
